Analyzer of ultrasonic flaw detection image

ABSTRACT

A flaw detection image analyzer ( 10 ) takes in an inspection procedure command stored in a flaw detection condition database ( 40 ), takes in a flaw detection image signal corresponding to a flaw detection image indicated by the taken inspection procedure command from a database ( 50 ) for flaw detection image signal, and displays the flaw detection image based on the flaw detection image signal on a display ( 30 ), with a display range and a contrast indicated by the inspection procedure command in an arrangement pattern of image indicated by the inspection procedure command. Consequently, optimum images can be displayed sequentially with optimum arrangement pattern, optimum display range and contrast according to a flaw to be inspected when a flaw is detected by observing an ultrasonic flaw detection image.

TECHNICAL FIELD

This invention relates to an analyzer or analytical apparatus for anultrasonic flaw detection image, which is designed to be capable ofreducing labor and time for conducting an inspection for a defect andalso capable of detecting the defect accurately regardless of the degreeof mastery.

BACKGROUND ART

The main wing of an aircraft has so far been produced using an aluminumalloy or a titanium alloy, but recently, has used a carbonfiber-reinforced plastic (CFRP) comprising a combination of carbonfibers and resin.

In the aircraft, damage to the wing poses a danger directly leading to aserious accident. Thus, it is very important to perform operations formaintenance and checkup, thereby finding a defect.

Defects occurring in the wing of the aircraft include a flaw, foreignmatter, a peel, and so on. As a nondestructive examination for detectingthese defects, an ultrasonic flaw detection test or inspection isadopted.

A general technique for the ultrasonic flaw detection test will beexplained first of all.

If a flaw detection range A is broad, as shown in FIG. 10, a flawdetection path P is established or set. Along this flaw detection pathP, an ultrasonic probe is moved to acquire a flaw detection waveformsignal (response waveform signal) by an ultrasonic wave.

If, at a certain point on the flaw detection path P, this site is asound site, a flaw detection waveform signal, which comprises a surfaceecho E_(s) and a bottom echo E_(b) as shown in FIG. 11, is obtained. If,at a certain point on the flaw detection path P, this site is adefective site, a flaw detection waveform signal, which comprises thesurface echo E_(s), the bottom echo E_(b), and a defect echo E_(d) asshown in FIG. 12, is obtained.

If the flaw detection range A is narrow, it is possible to detect adefect (detect the defect echo E_(d)) by visually observing the waveformof the flaw detection waveform signal throughout the flaw detection pathP. If the flaw detection range A is wide, on the other hand, the visualconfirmation of the waveform of the flaw detection waveform signal overthe entire flaw detection path P takes a huge time.

Under these circumstances, the flaw detection waveform signal issubjected to signal transformation or signal conversion to convert thissignal into a flaw detection image signal representing a flaw detectionimage in which the luminance or brightness value of the defective sitechanges relative to the brightness value of the sound site. By visuallyconfirming the flaw detection image based on this flaw detection imagesignal to determine whether there is a defect or not, a flaw detectionexamination or test is conducted in a short time.

If the presence of the defect is observed, a detailed analysis can bemade by confirming the flaw detection waveform which is the basis forthe flaw detection image.

As techniques for signal transformation for converting the flawdetection waveform signal into the flaw detection image signal, TOFimage signal transformation and AMP image signal transformation areknown.

To carry out signal transformation, a gate G with a predetermined rangeand at a predetermined height is set at a position between the surfaceecho E_(s) and the bottom echo E_(b) in each of FIG. 13 showing the flawdetection waveform signal on the sound site and FIG. 14 showing the flawdetection waveform signal on the defective site.

For conversion into a TOF image, the position where the set gate G andthe defect echo E_(d) intersect is converted into a brightness value.For conversion into an AMP image, the height of the defect echo E_(d)intersecting the set gate G is converted into a brightness value.

If a plurality of the defect echoes are present, there are versions, forexample, in which the first echo that intersects the gate G is used asthe defect echo E_(d), or the highest echo of the echoes intersectingthe gate G is used as the defect echo E_(d).

FIG. 15 shows an example of the flaw detection image of the sound site.FIG. 16 shows an example of the flaw detection image (TOF image) of thedefective site. FIG. 17 shows an example of the flaw detection image(AMP image) of the defective site.

As shown in these drawings, the flaw detection image shows thebrightness of the defective site changing relative to the brightness ofthe sound site, and enables the defective site to be inspected visuallywith rapidity and ease.

The waveform shape of the flaw detection waveform signal and the statusof occurrence of a noise differ according to the type of a defect or theplate thickness, shape, and material of the flaw detection site. Thus, asingle flaw detection image may be insufficient to determine accuratelywhether there is a defect or not.

Thus, a plurality of gates different in position or height are set, inaccordance with the type of the defect or the plate thickness, shape,and material of the flaw detection site, to generate a plurality of flawdetection image signals, and a plurality of flaw detection images by theplurality of flaw detection image signals are visually confirmed,whereby the presence or absence of the defect is determined overall.

That is, one flaw detection waveform signal obtained when the probe ismoved along the flaw detection path P is subjected to signaltransformation by a plurality of different signal transformationtechniques to obtain a plurality of flaw detection image signals, andflaw detection images by these plural flaw detection image signals areused to judge globally whether the defect is present or not.

Conversion of a flaw detection waveform signal into a TOF flaw detectionimage signal, and conversion of a flaw detection waveform signal into anAMP flaw detection image signal are different techniques for signaltransformation. Moreover, the conversion of a flaw detection waveformsignal into a TOF flaw detection image signal, with the gate Gdiffering, is also a different technique for signal transformation.Furthermore, the conversion of a flaw detection waveform signal into anAMP flaw detection image signal, with the gate G differing, is also adifferent technique for signal transformation. In these senses, thesemethods are called “a plurality of different signal transformationtechniques”.

A general example of globally judging the presence or absence of thedefect by the flaw detection images by the plurality of flaw detectionimage signals obtained by the signal transformation of the one flawdetection waveform signal will be described below.

If the types of the defect are two types, D1 and D2, the plate thicknessof the flaw detection site is 10 mm, the materials of the flaw detectionsite are of two types, M1 and M2, and the shape of the flaw detectionsite is of two types, F1 and F2, for example, a flaw detection image I1by a TOF flaw detection image signal obtained by signal transformationof the flaw detection waveform signal with a first gate being set, aflaw detection image I2 by a TOF flaw detection image signal obtained bysignal transformation of the flaw detection waveform signal with asecond gate being set, a flaw detection image I3 by an AMP flawdetection image signal obtained by signal transformation of the flawdetection waveform signal with a third gate being set, and a flawdetection image I4 by an AMP flaw detection image signal obtained bysignal transformation of the flaw detection waveform signal with afourth gate being set can be used for defect evaluation.

If the allocation of the flaw detection images I1 to I4 is made as inTable 1, the flaw detection images I1 to I4 are visually confirmed insequence, whereby all the defects can be evaluated.

TABLE 1 Example of allocation for defect evaluation by flaw detectionimages Plate thickness Material of Flaw Type of of flaw flaw detectionShape of flaw detection defect detection site site detection site imageD1 10 M1 F1 I1 D1 10 M1 F2 I1 D1 10 M2 F1 I2, I3 D1 10 M2 F2 I4 D2 10 M1F1 I1 D2 10 M1 F2 I2 D2 10 M2 F1 I1 D2 10 M2 F2 I2, I4

A conventional technique for conducting the ultrasonic flaw detectiontest of the main wing of an aircraft will be explained.

With the test of the main wing of the aircraft, the whole surface of themain wing is ultrasonically tested for flaw detection. However, it takestoo much time to analyze all of flaw detection waveforms by a flawdetection waveform signal obtained by this test. Thus, the acquired flawdetection waveform signal is subjected to signal transformation by aplurality of different signal transformation techniques to be convertedinto a plurality of flaw detection image signals. On a plurality of flawdetection images by the plurality of flaw detection image signals, adefective site is identified visually.

On the flaw detection image, the brightness value of the defective siteis increased (or decreased) compared with a sound site. By visuallyconfirming a change in brightness between the sound site and thedefective site, therefore, the defective site is identified.

In this case, the type and arrangement of the flaw detection image to bevisually confirmed differ according to the type of the defect to bedetected, or the difference of the site (shape, plate thickness,material). Moreover, the display magnification and contrast of the flawdetection image in which the defect is easy to detect are alsodifferent. This is because a manner of reflection of an ultrasonic wavediffers according to the type of the defect or the plate thickness,shape or material of each site.

Thus, an inspector repeatedly changes the type and arrangement, displayrange (magnification) and contrast of the flaw detection imagedisplayed, according to the type of the defect and the difference of thesite, and detects the defect by so doing.

The details of such a conventional inspection technique will bedescribed by reference to FIG. 18 which is a flowchart, and FIGS. 19 to21 showing flaw detection waveform images displayed on the displayscreen of an image display device.

Assume that a plurality of flaw detection image signals created bysignal transformation of a flaw detection waveform signal, which wasobtained by the ultrasonic flaw detection test of the main wing of anaircraft, by a plurality of different signal transformation techniqueshave been previously stored on a flaw detection image signal database.

In starting visual inspection work (Step S1 in FIG. 18), an operatoropens a plurality of flaw detection images I1 to In derived from aplurality of flaw detection image signals (Step S2).

Then, the type of a defect to be evaluated (for example, the defect D1of the first type) is determined (Step S3).

What type of defect should be investigated is judged based on knowledgepossessed by the operator (knowledge of the structure, shape, platethickness and material of the wing, knowledge of the characteristics ofthe ultrasonic flaw detection test, knowledge acquired throughinspection experiences accumulated, and so on).

The operator selects one or a plurality of the flaw detection imagesrequired, according to the type of the defect determined, and displaysthe selected image or images in an aligned arrangement on a displayscreen 1 of an image display device as shown in FIG. 19 (Step S4).

If the type of the defect is D1, for example, the flaw detection imageI1 and the flaw detection image I3 are selected, and both of the flawdetection images I1 and I3 are displayed in an side-by-side arrangement.

In this case, the flaw detection images I1 and I3 are each displayed insuch a manner as to be superposed on, for example, partitioned regionsR1 to R28 separated into 28 (4×7) regions by parting lines indicated byshort dashed lines in FIG. 19. That is, the flaw detection images I1 andI3 are each divided into images on the partitioned regions R1 to R28.

Which of the flaw detection images should be selected according to thetype of the defect, and how the selected images should be arranged, arejudged based on the knowledge possessed by the operator (knowledge ofthe structure, shape, plate thickness and material of the wing,knowledge of the type of the defect, knowledge of the characteristics ofthe ultrasonic flaw detection test, knowledge acquired throughinspection experiences accumulated thus far, and so on).

The operator changes the display range of the flaw detection images I1,I3.

Concretely, the starting position of X and Y coordinates displayed, andthe ending position of the X and Y coordinates are changed to specifythe partitioned regions to be displayed. Also, the display magnificationis optimally changed to display, on an enlarged scale, an image in apredetermined range, for example, on the partitioned region R1 of theflaw detection images I1 and I3 (Step S5), as shown in FIG. 19.

To what degree the display magnification should be adjusted to beincreased, and the image on which of the partitioned regions should bedisplayed, according to the type of the defect, are judged based on theknowledge possessed by the operator (knowledge of the structure, shape,plate thickness and material of the wing, knowledge of the type of thedefect, knowledge of the characteristics of the ultrasonic flawdetection test, knowledge acquired through inspection experiencesaccumulated thus far, and so on).

In the state of FIG. 20, the image on the partitioned region R1 hasmerely been enlarged. Hence, the contrast between an image showing thedefective site (a black-colored portion) and the sound site is notclear.

Thus, the operator makes a contrast adjustment for the enlarged imagesof the flaw detection images I1, I3 on the partitioned region R1 (FIG.20) to enhance the contrast between the image of the sound site and theimage of the defective site (Step S6).

To what degree the contrast should be adjusted, according to the type ofthe defect, is judged based on the knowledge possessed by the operator(knowledge of the structure, shape, plate thickness and material of thewing, knowledge of the type of the defect, knowledge of thecharacteristics of the ultrasonic flaw detection test, knowledgeacquired through inspection experiences accumulated thus far, and soon).

The operator visually confirms the images (FIG. 21) obtained byenlarging, and adjusting the contrast of, the flaw detection images I1,I3 on the partitioned region R, to evaluate whether the defective siteis present or not (Step S7).

The operator changes the display range of the flaw detection images I1,I3 from the image enlarged from the image on the partitioned region R1,successively, to the images enlarged from the images on the partitionedregions R2 to R28. When selecting the enlarged image on each of thepartitioned regions R2 to R28, the operator performs the optimalchanging of the display magnification, the contrast adjustment, and thevisual inspection of the defective site, which are shown in Steps S5, S6and S7, respectively, in accordance with the situation of the selectedpartitioned region.

After all the images on the partitioned regions R1 to R28 are inspectedfor the presence or absence of the defect D1 (Step S8), the type of thedefect to be evaluated is changed to the defect of a different type (forexample, defect D2) (Step S3).

For the defect D2, an inspection of the defective site is conducted inthe same manner as for the defect D1.

In this manner, the type of the defect is sequentially changed, andafter the inspection of the defective site is conducted for all types ofdefects, evaluation is completed (Step S9). Then, analysis work on theflaw detection images is completed (Step S10).

Depending on the type of the defect, the analysis of the flaw detectionimage in a specific partitioned region may be skipped, and this analysismay be made in a next partitioned region.

The reason is as follows: Knowledge or experience may teach, from thebeginning, that depending on a specific image selected and a specificdefect selected, defect detection in a specific partitioned region isimpossible. In this case, the analysis of the flaw detection image inthe specific partitioned region is skipped in order to cut down on timeand labor.

PRIOR ART DOCUMENTS Patent Documents

Patent Document 1: JP-A-9-251364

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

With the above-described conventional technique for inspecting the mainwing with the use of the flaw detection image signal, the type orarrangement of the image displayed, the display range (magnification) orthe contrast changes with the type of the defect or the partitionedregion. It takes time to change these factors.

Furthermore, an inspector of small experience may err in the type orarrangement of the image displayed, the display range (magnification) orthe contrast, posing the risk of an omission of defect detectionoccurring.

The present invention has been accomplished in the light of theabove-described conventional technology. It is an object of theinvention to provide an analytical apparatus for an ultrasonic flawdetection image which can reduce labor and time for conducting aninspection for a defect and can also detect a defect accuratelyregardless of the degree of mastery.

Means for Solving the Problems

An aspect of the present invention for solving the above problems is ananalytical apparatus for an ultrasonic flaw detection image, comprising:

a flaw detection image signal database division storing a plurality offlaw detection image signals obtained by signal transformation of anidentical flaw detection waveform signal by a plurality of differentsignal transformation techniques;

a flaw detection condition database division storing a flaw detectioncondition database constructed from many inspection procedure commandsarranged in order of execution, the inspection procedure commandshaving, as information, a type of a defect to be inspected for, a flawdetection image used in accordance with the type of the defect to beinspected for, an arrangement pattern of the flaw detection image used,a display range showing a range of an image region displayed among imageregions of the flaw detection image used, and contrast indicated valuesdefining a contrast of an image in the display range; and

a flaw detection image analyzer,

wherein the flaw detection image analyzer

captures the inspection procedure commands of the flaw detectioncondition database sequentially based on input commands from an outside,

whenever the inspection procedure command is captured, captures from theflaw detection image signal database division the flaw detection imagesignal corresponding to the flaw detection image indicated by thecaptured inspection procedure command, and

allows a display device to display the flaw detection image based on theflaw detection image signal in the arrangement pattern of the imageindicated by the inspection procedure command, in the display rangeindicated by the inspection procedure command, and with the contrastindicated by the inspection procedure command.

Another aspect of the present invention is an analytical apparatus foran ultrasonic flaw detection image, comprising:

a flaw detection image signal database division storing a plurality offlaw detection image signals obtained by signal transformation of anidentical flaw detection waveform signal by a plurality of differentsignal transformation techniques;

a flaw detection condition database division storing a first flawdetection condition database constructed from many inspection procedurecommands arranged in order of execution, the inspection procedurecommands having, as information, a type of a defect to be inspected for,and a display range showing a range of an image region displayed amongimage regions of a flaw detection image used; and a second flawdetection condition database defining the flaw detection image used, anarrangement pattern of the flaw detection image used, and contrastindicated values defining a contrast of an image in the display range,for each pattern comprising a combination of the type of the defect, aplate thickness, a shape, and a material;

a CAD model division having design data at least including data on aplate thickness, a shape and a material of an object to be inspected;and

a flaw detection image analyzer,

wherein the flaw detection image analyzer

captures the inspection procedure commands of the first flaw detectioncondition database sequentially based on input commands from an outside,

whenever the inspection procedure command is captured, captures from theCAD model division the plate thickness, shape, and material of acorresponding portion of the object to be inspected, which correspondsto the display range indicated by the captured inspection procedurecommand; incorporates the captured plate thickness, shape and materialinto the inspection procedure command; and captures by reference to thesecond flaw detection condition database the flaw detection image used,the arrangement pattern of the flaw detection image used, and thecontrast indicated values defining the contrast of the image in thedisplay range, which are defined for the pattern comprising thecombination of the type of the defect, and the plate thickness, theshape, and the material captured from the CAD model division, and

captures from the flaw detection image signal database division the flawdetection image signal corresponding to the flaw detection image used,and allows a display device to display the flaw detection image based onthe flaw detection image signal in the captured arrangement pattern ofthe image, in the captured display range, and with the capturedcontrast.

Still another aspect of the present invention is an analytical apparatusfor an ultrasonic flaw detection image, comprising:

a flaw detection image signal database division storing a plurality offlaw detection image signals obtained by signal transformation of anidentical flaw detection waveform signal by a plurality of differentsignal transformation techniques;

a flaw detection condition database division storing a first flawdetection condition database constructed from many inspection procedurecommands arranged in order of execution, the inspection procedurecommands having, as information, a type of a defect to be inspected for,and a display range showing a range of an image region displayed amongimage regions of a flaw detection image used; and a second flawdetection condition database defining the flaw detection image used, anarrangement pattern of the flaw detection image used, and contrastindicated values defining a contrast of an image in the display range,for each pattern comprising a combination of the type of the defect, aplate thickness, a shape, and a material;

a CAD model division having design data at least including data on ashape and a material of an object to be inspected;

a plate thickness measuring device for measuring a plate thickness ofthe object to be inspected; and

a flaw detection image analyzer,

wherein the flaw detection image analyzer

captures the inspection procedure commands of the first flaw detectioncondition database sequentially based on input commands from an outside,

whenever the inspection procedure command is captured, captures from theCAD model division the shape and material of a corresponding portion ofthe object to be inspected, which corresponds to the display rangeindicated by the captured inspection procedure command; incorporates thecaptured shape and material into the inspection procedure command;simultaneously captures the plate thickness measured by the platethickness measuring device as a plate thickness of the correspondingportion of the object to be inspected, which corresponds to the displayrange indicated by the captured inspection procedure command; andcaptures by reference to the second flaw detection condition databasethe flaw detection image used, the arrangement pattern of the flawdetection image used, and the contrast indicated values defining thecontrast of the image in the display range, which are defined for thepattern comprising the combination of the type of the defect, and theplate thickness, the shape, and the material captured from the CAD modeldivision and the plate thickness measuring device, and

captures from the flaw detection image signal database division the flawdetection image signal corresponding to the flaw detection image used,and allows a display device to display the flaw detection image based onthe flaw detection image signal in the captured arrangement pattern ofthe image, in the captured display range, and with the capturedcontrast.

Effects of the Invention

According to the present invention, in observing an ultrasonic flawdetection image to detect a defect, optimum images are displayedsequentially in an optimum arrangement pattern, in an optimum displayrange, and with an optimum contrast, in accordance with the defect to beinspected for. This saves an operator from having to manually select theimage or change the arrangement pattern, the display range or thecontrast, and can result in savings in labor and time for inspection.

Moreover, the defect can be detected accurately regardless of the degreeof mastery of the operator, and an omission of defect detection iseliminated.

BRIEF DESCRIPTION OF THE DRAWINGS

[FIG. 1] is a block diagram showing an analytical apparatus for anultrasonic flaw detection image according to Embodiment 1 of the presentinvention.

[FIG. 2] is a data drawing showing a flaw detection condition databaseused in Embodiment 1.

[FIG. 3] is a flowchart showing the operating state of Embodiment 1.

[FIG. 4] is a block diagram showing an analytical apparatus for anultrasonic flaw detection image according to Embodiment 2 of the presentinvention.

[FIG. 5] is a data drawing showing a first flaw detection conditiondatabase used in Embodiment 2.

[FIG. 6] is a data drawing showing a second flaw detection conditiondatabase used in Embodiment 2.

[FIG. 7] is a flowchart showing the operating state of Embodiment 2.

[FIG. 8] is a block diagram showing an analytical apparatus for anultrasonic flaw detection image according to Embodiment 3 of the presentinvention.

[FIG. 9] is a flowchart showing the operating state of Embodiment 3.

[FIG. 10] is an explanation drawing showing an example of a flawdetection path.

[FIG. 11] is a waveform chart showing an example of a flaw detectionwaveform.

[FIG. 12] is a waveform chart showing an example of a flaw detectionwaveform.

[FIG. 13] is a waveform chart showing an example of the flaw detectionwaveform and a gate.

[FIG. 14] is a waveform chart showing an example of the flaw detectionwaveform and the gate.

[FIG. 15] is an image view showing a flaw detection image of a soundsite.

[FIG. 16] is an image view showing a flaw detection image of a defectivesite.

[FIG. 17] is an image view showing a flaw detection image of thedefective site.

[FIG. 18] is a flowchart showing the conventional procedure foranalyzing a flaw detection image.

[FIG. 19] is an image view showing conventional flaw detection images.

[FIG. 20] is an image view showing the conventional flaw detectionimages.

[FIG. 21] is an image view showing the conventional flaw detectionimages.

MODE FOR CARRYING OUT THE INVENTION

Modes for carrying out the present invention will be described in detailbased on embodiments.

Embodiment 1

FIG. 1 is a block diagram showing an analytical apparatus for anultrasonic flaw detection image according to Embodiment 1 of the presentinvention. This analytical apparatus for an ultrasonic flaw detectionimage is composed of a flaw detection image analyzer 10, an input device20, an image display device 30, a flaw detection condition databasedivision 40, and a flaw detection image signal database division 50.

The flaw detection image signal database division 50 has a plurality offlaw detection image signals i1 to in stored beforehand. These pluralflaw detection image signals i1 to in are obtained by signaltransformation of a flaw detection waveform signal, which has beenacquired during the movement of an ultrasonic probe along a flawdetection path set on the main wing of an aircraft, by a plurality ofdifferent signal transformation techniques (a TOF image signaltransformation technique, an AMP image signal transformation technique,and signal transformation techniques rendered different in gate fromthese signal transformation techniques).

These plural flaw detection image signals i1 to in are fed to the imagedisplay device 30 via the flaw detection image analyzer 10, whereby flawdetection images I1 to In can be displayed on a display screen 31.

The flaw detection condition database division 40 has, prestoredtherein, a flaw detection condition database as shown in FIG. 2. Thisflaw detection condition database is a database constructed from manyinspection procedure commands C arranged in order of execution.

Each of the inspection procedure commands C is composed of the type of adefect to be inspected for, a flaw detection image used according to thetype of the defect to be inspected for, the arrangement pattern of theflaw detection image used, a display range showing the range of an imageregion displayed among the image regions of the flaw detection imageused, and contrast indicated values (maximum value and minimum value ofcontrast) defining the contrast of the image within the display range.

The inspection procedure command C1, for example, is composed ofinformation showing that the type of the defect to be inspected for isD1; the flaw detection image used according to the type D1 of the defectto be inspected for is I1; the arrangement pattern of the flaw detectionimage I1 used is maximum enlargement of one image on the screen; thedisplay range showing the range of the image region displayed among theimage regions of the flaw detection image I1 used is a range in whichthe starting position X1 on the X axis is 0, the ending position X2 onthe X axis is 10, the starting position Y1 on the Y axis is 0, and theending position Y2 on the Y axis is 20; and the contrast minimum valueof the contrast indicated values defining the contrast of the image inthe display range is 20, while the contrast maximum value of thecontrast indicated values is 40.

[00483 The inspection procedure command C101, for example, is composedof information showing that the type of the defect to be inspected foris D2; the flaw detection images used according to the type D2 of thedefect to be inspected for are I1 and I4; the arrangement pattern of theflaw detection images I1 and I4 used is display of the two images in alaterally aligned arrangement; the display range showing the range ofthe image region displayed among the image regions of the flaw detectionimages I1, I4 used is a range in which the starting position X1 on the Xaxis is 0, the ending position X2 on the X axis is 10, the startingposition Y1 on the Y axis is 0, and the ending position Y2 on the Y axisis 20; and the contrast minimum value of the contrast indicated valuesdefining the contrast of the image in the display range is 20 for theflaw detection image I1 and 30 for the flaw detection image I4, whilethe contrast maximum value of the contrast indicated values is 40 forthe flaw detection image I2 and 50 for the flaw detection image I4.

In the flaw detection condition database, the inspection procedurecommands (e.g., commands C1, C2, C3, C4 . . . ) for inspecting for thedefect of the same type (for example, defect D1) are set consecutivelyin order of execution.

Further, the display ranges of the plurality of inspection procedurecommands set consecutively in order of execution for detecting thedefect of the same type are set such that the display range instructedby the succeeding inspection procedure command is positionally displacedfrom the display range instructed by the preceding inspection procedurecommand.

Each of the inspection procedure commands C has, predetermined therein,the flaw detection image used, the arrangement pattern of the image, thedisplay range (magnification), and the contrast, according to the typeof the defect, so that the defect can be detected optimally inconsideration of the type of the defect and the shape, plate thicknessand material of each site.

If necessary, the contents of each inspection procedure command C can bemodified. This modification can be made by the entry of modificationdata by the operator via the input device 20.

The operator enters an instruction on start of the inspection into theflaw detection image analyzer 10 via the input device 20, thereby beingcapable of conducting the flaw detection test.

Next, the operating state of Embodiment 1 will be described withreference to a flowchart shown in FIG. 3.

In starting inspection work (Step S1 in FIG. 3), the operator enterscommands to open the flaw detection images and start evaluation into theflaw detection image analyzer 10 via the input device 20 (Steps S2, S3).

The flaw detection image analyzer 10 takes in or captures the flawdetection image signals i1 to in from the flaw detection image signaldatabase division 50, and stores the flaw detection image signals i1 toin into the memory within the flaw detection image analyzer 10.

An automatic operation is started by the flaw detection image analyzer10 (Step S4).

The flaw detection image analyzer 10 refers to the flaw detectioncondition database of the flaw detection condition database division 40,and carries out the inspections sequentially based on the informationindicated by the inspection procedure commands C.

The flaw detection image analyzer 10 first captures the inspectionprocedure command C1, thereby knowing that the type of the defect to beinspected for is D1 (Step S5). The flaw detection image analyzer 10 alsoknows that the flaw detection image used is I1, and that the one flawdetection image I1 will be displayed in a maximally enlarged size on thescreen, and displays the flaw detection image I1 based on the flawdetection image signal i1 in the maximum size on the display screen 31of the image display device 30 (Step S6).

The flaw detection image analyzer 10 also acquires, based on theinspection procedure command C1, the display range (i.e., the range inwhich the starting position X1 on the X axis is 0, the ending positionX2 on the X axis is 10, the starting position Y1 on the Y axis is 0, andthe ending position Y2 on the Y axis is 20), and displays the image inthe region of the above display range in the flaw detection image I1, inthe maximum size, on the display screen 31 (Step S7).

Furthermore, the flaw detection image analyzer 10 acquires, based on theinspection procedure command C1, the contrast indicated values (contrastminimum value is 20, and contrast maximum value is 40), and adjusts thecontrast of the image in the region of the above display range in theflaw detection image I1, which has been displayed in the maximum size onthe display screen 31, according to the above contrast indicated values(Step S8).

The operator visually confirms the flaw detection image displayed on thedisplay screen 31 of the image display device 30 (image displayed in themaximum size on the display screen 31 with a specific contrast in adisplay range in a specific region (at a specific magnification)designated by the inspection procedure command C1 in the flaw detectionimage I1) to evaluate whether the defect D1 is present or absent (StepS9).

After evaluating the presence or absence of the defect D1 by visualinspection, the operator issues a command for proceeding to a nextaction (Step S10).

The flaw detection image analyzer 10 captures the inspection procedurecommand C2, performs the actions of Steps S5 to S8 based on theinspection procedure command C2, and displays the image of a specificcontrast, in the display range in the specific region of the flawdetection image I1 designated by the inspection procedure command C2, ona maximally enlarged scale, on the display screen 31.

The operator visually confirms the flaw detection image displayed on thedisplay screen 31 of the image display device 30 (image displayed in themaximum size on the display screen 31 with a specific contrast in adisplay range in a specific region (at a specific magnification)designated by the inspection procedure command C2 in the flaw detectionimage I1) to evaluate whether the defect D1 is present or absent (StepS9).

After evaluating the presence or absence of the defect D1 by visualinspection, the operator issues a command to proceed to a next action(Step S10).

Such actions are also performed under the inspection procedure commandsC3, C4, . . . which have been set consecutively.

After the evaluation of the entire screen is completed in connectionwith the inspection for the presence or absence of the defect D1 (StepS11), the flaw detection image analyzer 10 captures the inspectionprocedure command C101, which is the inspection procedure command toinspect for the defect D2, in order to inspect for the presence orabsence of the next defect D2.

The flaw detection image analyzer 10 first captures the inspectionprocedure command C101, thereby knowing that the type of the defect tobe inspected for is D2 (Step S5). The flaw detection image analyzer 10also knows that the flaw detection images used are I1, I4, and that thetwo flaw detection images I1 and I4 will be displayed in a laterallyaligned arrangement on the screen, and displays the flaw detectionimages I1, I4 based on the flaw detection image signals i1, i4 in thelaterally aligned arrangement on the display screen 31 of the imagedisplay device 30 (Step S6).

The flaw detection image analyzer 10 also acquires, based on theinspection procedure command C101, the display range (i.e., the range inwhich the starting position X1 on the X axis is 0, the ending positionX2 on the X axis is 10, the starting position Y1 on the Y axis is 0, andthe ending position Y2 on the Y axis is 20), and displays the images inthe region of the above display range in the flaw detection images I1,I4, in the laterally aligned arrangement, on the display screen 31 (StepS7).

Furthermore, the flaw detection image analyzer 10 acquires, based on theinspection procedure command C101, the contrast indicated values(contrast minimum value is 20 for the flaw detection image I1 and 30 forthe flaw detection image I4, and contrast maximum value is 40 for theflaw detection image I1 and 50 for the flaw detection image I4), andadjusts the contrast of the images in the region of the above displayrange in the flaw detection images I1, I4, which have been displayed inthe laterally aligned arrangement on the display screen 31, according tothe above contrast indicated values (Step S8).

The operator visually confirms the flaw detection images displayed onthe display screen 31 of the image display device 30 (images displayedin the laterally aligned arrangement on the display screen 31 with thespecific contrast in the display range in the specific region (at aspecific magnification) designated by the inspection procedure commandC101 in the flaw detection images I1, I4) to evaluate whether the defectD2 is present or absent (Step S9).

After evaluating the presence or absence of the defect D2 by visualinspection, the operator issues a command to proceed to a next action(Step S10).

Under this command, the flaw detection image analyzer 10 captures theinspection procedure command C102, performs the actions of Steps S5 toS8 based on the inspection procedure command C102, and displays theimages of the specific contrast, in the display range in the specificregion of the flaw detection images I1, I4 designated by the inspectionprocedure command C102, in the laterally aligned arrangement, on thedisplay screen 31.

The operator visually confirms the flaw detection images displayed onthe display screen 31 of the image display device 30 (images displayedin the laterally aligned arrangement on the display screen 31 with thespecific contrast in the display range in the specific region (at thespecific magnification) designated by the inspection procedure commandC102 in the flaw detection images I1, I4) to evaluate whether the defectD2 is present or absent (Step S9).

After evaluating the presence or absence of the defect D2 by visualinspection, the operator issues a command to proceed to a next action(Step S10).

Such actions are also performed under the inspection procedure commandsC103, . . . which have been set consecutively.

After the evaluation of the entire screen is completed in connectionwith the inspection for the presence or absence of the defect D2 (StepS11), the flaw detection image analyzer 10 captures the inspectionprocedure command CN, which is the inspection procedure command toinspect for the defect D3, in order to inspect for the presence orabsence of the next defect D3, and displays images upon the sameprocessings as mentioned above. The operator visually confirms thedisplayed images, and can thereby evaluate whether the defect is presentor absent.

When the inspection procedure command C has been executed up to the endto complete the evaluation of all the defects (Step S12), the flawdetection image analyzer 10 terminates the automatic operation (StepS13), whereupon the analysis work on the flaw detection images (defectdetection work) is completed (Step S14).

It is possible to make setting such that when the operator has visuallyconfirmed the defect, the site and type of the defect are stored intothe flaw detection image analyzer 10 and, after completion of work onthe defect inspection, the stored defective sites are displayed on thedisplay screen 31 by the type of the defect.

In the above-described manner, the flaw detection image analyzer 10performs the automatic operation, whereby the images of the optimal typeare displayed sequentially on the display screen 31 of the image displaydevice 30 in the optimal arrangement state, in the optimal display range(magnification) with the optimal contrast, in accordance with the typeof each defect. Thus, the operator can conduct the inspection for thedefect while looking at the display screen, without the need to selectthe image or to carry out an operation for changing the displayposition, display magnification, or the like.

Hence, the inspection for the defect can be easily performed in a shorttime, and even an inspector with little experience can conduct thedefect inspection accurately without an omission of inspection.

Embodiment 2

FIG. 4 is a block diagram showing an analytical apparatus for anultrasonic flaw detection image according to Embodiment 2 of the presentinvention. This analytical apparatus for an ultrasonic flaw detectionimage is composed of a flaw detection image analyzer 10, an input device20, an image display device 30, a flaw detection condition databasedivision 40, a flaw detection image signal database division 50, and athree-dimensional CAD model division 60.

The three-dimensional CAD model division 60 has in storage various datanecessary for designing an object to be inspected (e.g., the main wingof an aircraft), for example, design data, such as plate thickness,shape, material, dimensions, and structure.

The flaw detection image signal database division 50 has a plurality offlaw detection image signals i1 to in stored beforehand. These pluralflaw detection image signals i1 to in are obtained by signaltransformation of a flaw detection waveform signal, which has beenacquired during the movement of an ultrasonic probe along a flawdetection path set on the main wing of an aircraft, by a plurality ofdifferent signal transformation techniques (a TOF image signaltransformation technique, an AMP image signal transformation technique,and signal transformation techniques rendered different in gate fromthese signal transformation techniques).

These flaw detection image signals i1 to in are fed to the image displaydevice 30 via the flaw detection image analyzer 10, whereby flawdetection images I1 to In can be displayed on a display screen 31.

The flaw detection condition database division 40 has, prestoredtherein, a first flaw detection condition database DB1 as shown in FIG.5, and a second flaw detection condition database DB2 as shown in FIG.6.

The first flaw detection condition database DB1 shown in FIG. 5 is adatabase constructed from many inspection procedure commands C arrangedin order of execution. In FIG. 5, data such as plate thickness, shapeand material are already described, but initially, these data, i.e.,plate thickness, shape and material, have not been described. As will bedescribed later, these data are taken in or captured by reference to CADdata stored in the three-dimensional CAD model division 60.

The first flaw detection condition database DB1 shown in FIG. 5 will bedescribed. Each of the inspection procedure commands C is composed ofthe type of a defect to be inspected for, and a display range showingthe range of an image region displayed among the image regions of theflaw detection image.

As will be described later, in executing each inspection procedurecommand C, the flaw detection image analyzer 10 acquires the platethickness, shape and material of the corresponding portion of the objectto be inspected (main wing), which corresponds to the display range,from the CAD data, and integrates (records) them into each inspectionprocedure command C.

The inspection procedure command C1, for example, is composed ofinformation showing that the type of the defect to be inspected for isD1; and the display range showing the range of the image regiondisplayed among the image regions of the flaw detection image used is arange in which the starting position X1 on the X axis is 0, the endingposition X2 on the X axis is 10, the starting position Y1 on the Y axisis 0, and the ending position Y2 on the Y axis is 20.

The inspection procedure command C101, for example, is composed ofinformation showing that the type of the defect to be inspected for isD2; and the display range showing the range of the image regiondisplayed among the image regions of the flaw detection image used is arange in which the starting position X1 on the X axis is 0, the endingposition X2 on the X axis is 10, the starting position Y1 on the Y axisis 0, and the ending position Y2 on the Y axis is 20.

In the first flaw detection condition database DB1, the inspectionprocedure commands (e.g., commands C1, C2, C3, C4 . . . ) for inspectingfor the defect of the same type (for example, defect D1) are setconsecutively in order of execution.

Further, the display ranges of the plurality of inspection procedurecommands set consecutively in order of execution for detecting thedefect of the same type are set such that the display range indicated bythe succeeding inspection procedure command is positionally displacedfrom the display range indicated by the preceding inspection procedurecommand.

Next, the second flaw detection condition database DB2 shown in FIG. 6will be described. The second flaw detection condition database DB2defines a flaw detection image used, the arrangement pattern of the flawdetection image used, and contrast indicated values (minimum value andmaximum value of contrast) defining the contrast of the image in thedisplay range, for each pattern comprising a combination of the type ofthe defect, plate thickness, shape, and material.

The second flaw detection condition database DB2 has, predeterminedtherein, the flaw detection image used, the arrangement pattern of theimage, and the contrast, according to the type of the defect, so thatthe defect can be detected optimally in consideration of the type of thedefect, the shape, plate thickness, and material of each site.

If necessary, the contents of the flaw detection condition databasesDB1, DB2 can be modified. This modification can be made by the entry ofmodification data by the operator via the input device 20.

Next, the operating state of Embodiment 2 will be described withreference to a flowchart shown in FIG. 7.

In starting inspection work (Step S1 in FIG. 7), the operator enterscommands to open the flaw detection images and issue instructions tostart evaluation, into the flaw detection image analyzer 10 via theinput device 20 (Steps S2, S3).

The flaw detection image analyzer 10 captures the flaw detection imagesignals i1 to in from the flaw detection image signal database division50, and stores the flaw detection image signals i1 to in into the memorywithin the flaw detection image analyzer 10.

An automatic operation is started by the flaw detection image analyzer10 (Step S4).

The flaw detection image analyzer 10 refers to the first flaw detectioncondition database DB1 of the flaw detection condition database division40, and carries out the inspection sequentially based on the informationindicated by the inspection procedure commands C.

The flaw detection image analyzer 10 first captures the inspectionprocedure command C1, thereby knowing that the type of the defect to beinspected for is D1 (Step S5). The flaw detection image analyzer 10 alsoacquires the display range (the range in which the starting position X1on the X axis is 0, the ending position X2 on the X axis is 10, thestarting position Y1 on the Y axis is 0, and the ending position Y2 onthe Y axis is 20) (Step S6).

Then, the flaw detection image analyzer 10 captures the plate thickness,shape, and material of the corresponding portion of the object to beinspected (main wing), which corresponds to the display range acquiredin Step S6, by reference to the CAD data stored in the three-dimensionalCAD model division 60, and stores the captured CAD data (the platethickness is 10, the shape is F1, and the material is M1) in a formbuilt into the inspection procedure command C1 (Step S7).

The flaw detection image analyzer 10 refers to the second flaw detectioncondition database DB2 of the flaw detection condition database division40, acquiring the information set in the pattern comprising acombination of the defect type D1, plate thickness (10), shape (F1) andmaterial (M1), namely, the information that the flaw detection imageused is I1, the arrangement pattern of the flaw detection image I1 usedis the maximum enlargement of a single image on the screen, the contrastminimum value of the contrast indicated values defining the contrast ofthe image in the display range is 20, and the contrast maximum value is40 (Step S8).

By referring to the inspection procedure command C1 of the first flawdetection condition database DB1, the CAD data stored in thethree-dimensional CAD model division 60, and the second flaw detectioncondition database DB2 in the above-mentioned manner, it is possible toacquire the information that the type of the defect to be inspected foris D1, the flaw detection image used in accordance with the type D1 ofthe defect to be inspected for is I1, the arrangement pattern of theflaw detection image I1 used is the maximum enlargement of a singleimage on the screen, the display range showing the range of the imageregion to be displayed among the image regions of the flaw detectionimage I1 used is the range in which the starting position X1 on the Xaxis is 0, the ending position X2 on the X axis is 10, the startingposition Y1 on the Y axis is 0, and the ending position Y2 on the Y axisis 20, and the contrast minimum value of the contrast indicated valuesdefining the contrast of the image in the display range is 20, and thecontrast maximum value is 40.

Based on the so acquired information, the flaw detection image analyzer10 maximally enlarges a single image, of the flaw detection image I1based on the flaw detection image signal i1, in the above display range(the starting position X1 on the X axis is 0, the ending position X2 onthe X axis is 10, the starting position Y1 on the Y axis is 0, and theending position Y2 on the Y axis is 20) with the above contrast (thecontrast minimum value is 20, and the contrast maximum value is 40), anddisplays the enlarged image on the display screen 31 of the imagedisplay device 30.

The operator visually confirms the flaw detection image displayed on thedisplay screen 31 of the image display device 30 (the image displayed ina maximum size on the display screen 31 with a specific contrast in thedisplay range in a specific region (magnification) of the flaw detectionimage I1) to evaluate whether the defect D1 is present or not (Step S9).

After evaluating the presence or absence of the defect D1 visually, theoperator issues a command to proceed to a next action (Step S10).

The flaw detection image analyzer 10 captures the inspection procedurecommand C2, and performs the actions of Steps S5 to S8 by referring tothe inspection procedure command C2, the CAD data stored in thethree-dimensional CAD model division 60, and the second flaw detectioncondition database DB2. By so doing, the flaw detection image analyzer10 maximally enlarges a single image, of the flaw detection image I1, ina display range in a specific region (the starting position X1 on the Xaxis is 10, the ending position X2 on the X axis is 20, the startingposition Y1 on the Y axis is 0, and the ending position Y2 on the Y axisis 20) with a specific contrast (the contrast minimum value is 20, andthe contrast maximum value is 40), and displays the enlarged image onthe display screen 31.

The operator visually confirms the flaw detection image displayed on thedisplay screen 31 of the image display device 30 (the image displayed inthe maximum size on the display screen 31 with the specific contrast inthe display range in the specific region (magnification) of the flawdetection image I1) to evaluate whether the defect D1 is present or not(Step S9).

After visually evaluating the presence or absence of the defect D1, theoperator issues a command to proceed to a next action (Step S10).

Such actions are also performed under the inspection procedure commandsC3, C4 . . . , which have been set consecutively, by reference to theCAD stored in the three-dimensional CAD model division 60, and thesecond flaw detection condition database DB2.

After the evaluation of the entire screen is completed in connectionwith the inspection for the presence or absence of the defect D1 (StepS11), the flaw detection image analyzer 10 captures the inspectionprocedure command C101, which is the inspection procedure command toinspect for the defect D2, in order to inspect for the presence orabsence of the next defect D2.

The flaw detection image analyzer 10 first captures the inspectionprocedure command C101, thereby knowing that the type of the defect tobe inspected for is D2 (Step S5). The flaw detection image analyzer 10also captures the display range (the range in which the startingposition X1 on the X axis is 0, the ending position X2 on the X axis is10, the starting position Y1 on the Y axis is 0, and the ending positionY2 on the Y axis is 20) (Step S6).

Then, the flaw detection image analyzer 10 captures the plate thickness,shape, and material of the corresponding portion of the object to beinspected (main wing), which corresponds to the display range acquiredin Step S6, by reference to the CAD data stored in the three-dimensionalCAD model division 60, and stores the captured CAD data (the platethickness is 10, the shape is F2, and the material is M2) in a formbuilt into the inspection procedure command C101 (Step S7).

The flaw detection image analyzer 10 refers to the second flaw detectioncondition database DB2 of the flaw detection condition database division40, acquiring the information set in the pattern comprising acombination of the defect type D2, plate thickness (10), shape (F2) andmaterial (M2), namely, the information that the flaw detection imagesused are I1 and I3, the arrangement pattern of the flaw detection imagesI1, I2 used is the placement of the two images in a laterally alignedarrangement, the contrast minimum value of the contrast indicated valuesdefining the contrast of the image in the display range is 20 for theflaw detection image I1 and 30 for the flaw detection image I3, and thecontrast maximum value is 40 for the flaw detection image I1 and 50 forthe flaw detection image I3 (Step S8).

By referring, in the above-mentioned manner, to the inspection procedurecommand C2 of the first flaw detection condition database DB1, the CADdata stored in the three-dimensional CAD model division 60, and thesecond flaw detection condition database DB2, it becomes possible toacquire the information showing that the type of the defect to beinspected for is D2, the flaw detection images used in accordance withthe type D2 of the defect to be inspected for are I1, I3, thearrangement pattern of the flaw detection images I1, I3 used is theplacement of the two images in the laterally aligned arrangement, thedisplay range showing the range of the image region displayed among theimage regions of the flaw detection images I1, I3 used is the range inwhich the starting position X1 on the X axis is 0, the ending positionX2 on the X axis is 10, the starting position Y1 on the Y axis is 0, andthe ending position Y2 on the Y axis is 20, and the contrast minimumvalue of the contrast indicated values defining the contrast of theimage in the display range is 20 for the flaw detection image I1 and 30for the flaw detection image I3, and the contrast maximum value is 40for the flaw detection image I1 and 50 for the flaw detection image I3.

Based on the so acquired information, the flaw detection image analyzer10 displays two images in a laterally aligned arrangement on the displayscreen 31 of the image display device 30, the two images being images ofthe flaw detection images I1, I3 based on the flaw detection imagesignals i1, i3 and being in the above display range (the startingposition X1 on the X axis is 0, the ending position X2 on the X axis is10, the starting position Y1 on the Y axis is 0, and the ending positionY2 on the Y axis is 20) with the above contrast (the contrast minimumvalue is 20 for the flaw detection image I1 and 30 for the flawdetection image I3, and the contrast maximum value is 40 for the flawdetection image I1 and 50 for the flaw detection image I3).

The operator visually confirms the flaw detection images displayed onthe display screen 31 of the image display device 30 (the imagesdisplayed in a laterally aligned arrangement on the display screen 31with the specific contrast in the display range in the specific region(magnification) of the flaw detection images I1, I3) to evaluate whetherthe defect D2 is present or not (Step S9).

After visually evaluating the presence or absence of the defect D2, theoperator issues a command to proceed to a next action (Step S10).

Under this command, the flaw detection image analyzer 10 captures theinspection procedure command C102, and performs the actions of Steps S5to S8 while referring to the inspection procedure command C102, the CADdata stored in the three-dimensional CAD model division 60, and thesecond flaw detection condition database DB2. By so doing, the flawdetection image analyzer 10 displays two images in a laterally alignedarrangement on the display screen 31, the two images being images of theflaw detection images I1, I3 and being in a display range in a specificregion (the starting position X1 on the X axis is 10, the endingposition X2 on the X axis is 20, the starting position Y1 on the Y axisis 0, and the ending position Y2 on the Y axis is 20) with a specificcontrast (the contrast minimum value is 20 for the flaw detection imageI1 and 30 for the flaw detection image I3, and the contrast maximumvalue is 40 for the flaw detection image I1 and 50 for the flawdetection image I3).

The operator visually confirms the flaw detection images displayed onthe display screen 31 of the image display device 30 (the imagesdisplayed in a laterally aligned arrangement on the display screen 31with the specific contrast in the display range in the specific region(magnification) of the flaw detection images I1, I3) to evaluate whetherthe defect D2 is present or not (Step S9).

After visually evaluating the presence or absence of the defect D2, theoperator issues a command to proceed to a next action (Step S10).

Such actions are also performed under the inspection procedure commandsC103 . . . , which have been set consecutively, by reference to the CADdata stored in the three-dimensional CAD model division 60, and thesecond flaw detection condition database DB2.

After the evaluation of the entire screen is completed in connectionwith the inspection for the presence or absence of the defect D2 (StepS11), the flaw detection image analyzer 10 captures the inspectionprocedure command CN, which is the inspection procedure command toinspect for the defect D3, in order to inspect for the presence orabsence of the next defect D3. The flaw detection image analyzer 10performs the same processings as mentioned above, and displays theimages. The operator visually confirms the displayed images, and canthereby evaluate whether the defect is present or not.

After the inspection procedure command C is executed up to the end andthe evaluation of all the defects is completed (Step S12), the flawdetection image analyzer 10 terminates the automatic operation (StepS13), and then the analysis work on the flaw detection images (defectdetection work) is completed (Step S14).

It is possible to make settings such that when the operator has visuallyconfirmed the defect, the site and type of the defect are stored intothe flaw detection image analyzer 10 and, after completion of work onthe defect inspection, the stored defective sites are displayed on thedisplay screen 31 by the type of the defect.

In the above-described manner, the flaw detection image analyzer 10performs the automatic operation, whereby the images of the optimal typein the optimal arrangement state, in the optimal display range(magnification) with the optimal contrast are sequentially displayed onthe display screen 31 of the image display device 30 in accordance withthe type of each defect. Thus, the operator can conduct the inspectionfor the defect while looking at the display screen, without the need toselect the image or to carry out an operation for changing the displayposition, display magnification, or the like.

Hence, the inspection for the defect can be easily performed in a shorttime, and even an inspector with little experience can conduct thedefect inspection accurately without an omission of inspection.

Based on the type of the defect, plate thickness, shape, and material,moreover, the flaw detection image used, and the arrangement pattern andcontrast of the image are acquired from the second flaw detectioncondition database DB2. This obviates the necessity of registering theflaw detection image used, and the arrangement pattern and contrast ofthe image, individually on all the inspection procedure commands. Thus,it becomes easy to create a flaw detection condition database as awhole.

Embodiment 3

FIG. 8 is a block diagram showing an analytical apparatus for anultrasonic flaw detection image according to Embodiment 3 of the presentinvention. This analytical apparatus for an ultrasonic flaw detectionimage is composed of a flaw detection image analyzer 10, an input device20, an image display device 30, a flaw detection condition databasedivision 40, a flaw detection image signal database division 50, athree-dimensional CAD model division 60, and a plate thickness measuringdevice 70.

The plate thickness measuring device 70 actually measures the platethickness of an object to be inspected (for example, the main wing of anaircraft), and outputs its measured value (plate thickness).

The three-dimensional CAD model division 60 has in storage various datanecessary for designing the object to be inspected (e.g., the main wingof an aircraft), for example, design data, such as plate thickness,shape, material, dimensions, and structure.

The flaw detection image signal database division 50 has a plurality offlaw detection image signals i1 to in stored beforehand. These pluralflaw detection image signals i1 to in are obtained by signaltransformation of a flaw detection waveform signal, which has beenacquired during the movement of an ultrasonic probe along a flawdetection path set on the main wing of an aircraft, by a plurality ofdifferent signal transformation techniques (a TOF image signaltransformation technique, an AMP image signal transformation technique,and signal transformation techniques rendered different in gate fromthese signal transformation techniques).

These flaw detection image signals i1 to in are fed to the image displaydevice 30 via the flaw detection image analyzer 10, whereby flawdetection images I1 to In can be displayed on a display screen 31.

The flaw detection condition database division 40 has, prestoredtherein, a first flaw detection condition database DB1 as shown in FIG.5, and a second flaw detection condition database DB2 as shown in FIG.6, as in Embodiment 2.

The first flaw detection condition database DB1 shown in FIG. 5 is adatabase constructed from many inspection procedure commands C beingarranged in order of execution. In FIG. 5, data such as plate thickness,shape and material are already described, but initially, these data,plate thickness, shape and material, have not been stored. As will bedescribed later, the shape and material are captured by reference to CADdata stored in the three-dimensional CAD model division 60, while theplate thickness is captured as a measured value (plate thickness)obtained by actually measuring the plate thickness of the object to beinspected in the wing by means of the plate thickness measuring device70.

The first flaw detection condition database DB1 shown in FIG. 5 will bedescribed. Each inspection procedure command C is composed of the typeof a defect to be inspected for, and a display range showing the rangeof an image region displayed among the image regions of the flawdetection image.

As will be described later, in executing each inspection procedurecommand C, the flaw detection image analyzer 10 acquires the shape andmaterial of the corresponding portion of the object to be inspected(main wing), which corresponds to the display range, from the CAD data,and integrates (records) them into each inspection procedure command C.The flaw detection image analyzer 10 also acquires the plate thicknessactually measured by the plate thickness measuring device 70, as theplate thickness of the corresponding portion of the object to beinspected (main wing), which corresponds to the display range, andintegrates (records) it into each inspection procedure command C.

The inspection procedure command C1, for example, is composed ofinformation showing that the type of the defect to be inspected for isD1; and the display range showing the range of the image regiondisplayed among the image regions of the flaw detection image used is arange in which the starting position X1 on the X axis is 0, the endingposition X2 on the X axis is 10, the starting position Y1 on the Y axisis 0, and the ending position Y2 on the Y axis is 20.

The inspection procedure command C101, for example, is composed ofinformation showing that the type of the defect to be inspected for isD2; and the display range showing the range of the image regiondisplayed among the image regions of the flaw detection image used is arange in which the starting position X1 on the X axis is 0, the endingposition X2 on the X axis is 10, the starting position Y1 on the Y axisis 0, and the ending position Y2 on the Y axis is 20.

In the first flaw detection condition database DB1, the inspectionprocedure commands (e.g., commands C1, C2, C3, C4 . . . ) for inspectingfor the defect of the same type (for example, defect D1) are setconsecutively in order of execution.

Further, the display ranges of the plurality of inspection procedurecommands set consecutively in order of execution for detecting thedefect of the same type are set such that the display range indicated bythe succeeding inspection procedure command is positionally displacedfrom the display range indicated by the preceding inspection procedurecommand.

Next, the second flaw detection condition database DB2 shown in FIG. 6will be described. The second flaw detection condition database DB2specifies a flaw detection image used, the arrangement pattern of theflaw detection image used, and contrast indicated values (maximum valueand minimum value of contrast) defining the contrast of the image in thedisplay range, for each pattern comprising a combination of the type ofthe defect, plate thickness, shape, and material.

The second flaw detection condition database DB2 has, predeterminedtherein, the flaw detection image used, the arrangement pattern of theimage, and the contrast, according to the type of the defect, so thatthe defect can be detected optimally in consideration of the type of thedefect, the shape, plate thickness, and material of each site.

If necessary, the contents of the flaw detection condition databasesDB1, DB2 can be modified. This modification can be made by the entry ofmodification data by the operator via the input device 20.

Next, the operating state of Embodiment 3 will be described withreference to a flowchart shown in FIG. 9.

In starting inspection work (Step S1 in FIG. 9), the operator enterscommands to open the flaw detection images and issue instructions tostart evaluation, into the flaw detection image analyzer 10 via theinput device 20 (Steps S2, S3).

Under these commands, the flaw detection image analyzer 10 captures theflaw detection image signals i1 to in from the flaw detection imagesignal database division 50, and stores the flaw detection image signalsi1 to in into the memory within the flaw detection image analyzer 10.

An automatic operation is started by the flaw detection image analyzer10 (Step S4).

The flaw detection image analyzer 10 refers to the first flaw detectioncondition database DB1 of the flaw detection condition database division40, and carries out the inspection sequentially based on the informationindicated by the inspection procedure command C.

The flaw detection image analyzer 10 first captures the inspectionprocedure command C1, thereby knowing that the type of the defect to beinspected for is D1 (Step S5). The flaw detection image analyzer 10 alsoknows the display range (the range in which the starting position X1 onthe X axis is 0, the ending position X2 on the X axis is 10, thestarting position Y1 on the Y axis is 0, and the ending position Y2 onthe Y axis is 20) (Step S6).

Then, the flaw detection image analyzer 10 captures the shape andmaterial of the corresponding portion of the object to be inspected(main wing), which corresponds to the display range acquired in Step S6,by reference to the CAD data stored in the three-dimensional CAD modeldivision 60, and stores the captured CAD data (the shape is F1, and thematerial is Ml) in a form built into the inspection procedure command C1(Step S7).

The plate thickness of the corresponding portion of the object to beinspected (main wing) is measured by the plate thickness measuringdevice 70. The flaw detection image analyzer 10 captures the measuredplate thickness, and stores the captured plate thickness data (the platethickness is 10) in a form built into the inspection procedure commandC1 (Step S8).

The flaw detection image analyzer 10 refers to the second flaw detectioncondition database DB2 of the flaw detection condition database division40, acquiring the information set in the pattern comprising acombination of the defect type D1, plate thickness (10), shape (F1) andmaterial (M1), namely, the information that the flaw detection imageused is I1, the arrangement pattern of the flaw detection image I1 usedis the maximal enlargement of a single image on the screen, the contrastminimum value of the contrast indicated values defining the contrast ofthe image in the display range is 20, and the contrast maximum value is40 (Step S9).

By so referring to the inspection procedure command C1 of the first flawdetection condition database DB1, the CAD data stored in thethree-dimensional CAD model division 60, the plate thickness data fromthe measurement by the plate thickness measuring device 70, and thesecond flaw detection condition database DB2, it is possible to acquirethe information that the type of the defect to be inspected for is D1,the flaw detection image used in accordance with the type D1 of thedefect to be inspected for is I1, the arrangement pattern of the flawdetection image I1 used is the maximal enlargement of the single imageon the screen, the display range showing the range of the image regiondisplayed among the image regions of the flaw detection image I1 used isthe range in which the starting position X1 on the X axis is 0, theending position X2 on the X axis is 10, the starting position Y1 on theY axis is 0, and the ending position Y2 on the Y axis is 20, and thecontrast minimum value of the contrast indicated values defining thecontrast of the image in the display range is 20, and the contrastmaximum value is 40.

Based on the so acquired information, the flaw detection image analyzer10 maximally enlarges a single image, of the flaw detection image I1based on the flaw detection image signal i1, in the above display range(the starting position X1 on the X axis is 0, the ending position X2 onthe X axis is 10, the starting position Y1 on the Y axis is 0, and theending position Y2 on the Y axis is 20) with the above contrast (thecontrast minimum value is 20, and the contrast maximum value is 40), anddisplays the enlarged image on the display screen 31 of the imagedisplay device 30.

The operator visually confirms the flaw detection image displayed on thedisplay screen 31 of the image display device 30 (the image displayed ina maximum size on the display screen 31 with the specific contrast inthe display range in the specific region (magnification) of the flawdetection image I1) to evaluate whether the defect D1 is present or not(Step S10).

After visually evaluating the presence or absence of the defect D1, theoperator issues a command to proceed to a next action (Step S11).

Under this command, the flaw detection image analyzer 10 captures theinspection procedure command C2, and performs the actions of Steps S5 toS9 while referring to the inspection procedure command C2, the CAD datastored in the three-dimensional CAD model division 60, the platethickness data from the measurement by the plate thickness measuringdevice 70, and the second flaw detection condition database DB2. By sodoing, the flaw detection image analyzer 10 maximally enlarges a singleimage, of the flaw detection image I1, in the display range in aspecific region (the starting position X1 on the X axis is 10, theending position X2 on the X axis is 20, the starting position Y1 on theY axis is 0, and the ending position Y2 on the Y axis is 20) with aspecific contrast (the contrast minimum value is 20, and the contrastmaximum value is 40), and displays the enlarged image on the displayscreen 31.

The operator visually confirms the flaw detection image displayed on thedisplay screen 31 of the image display device 30 (the image displayed ina maximum size on the display screen 31 with the specific contrast inthe display range in the specific region (magnification) of the flawdetection image I1) to evaluate whether the defect D1 is present or not(Step S10).

After visually evaluating the presence or absence of the defect D1, theoperator issues a command to proceed to a next action (Step S11).

Such actions are also performed under the inspection procedure commandsC3, C4 . . . , which have been set consecutively, by reference to theCAD data stored in the three-dimensional CAD model division 60, theplate thickness data obtained by the measurement by the plate thicknessmeasuring device 70, and the second flaw detection condition databaseDB2.

After the evaluation of the entire screen is completed in connectionwith the inspection for the presence or absence of the defect D1 (StepS12), the flaw detection image analyzer 10 captures the inspectionprocedure command C101, which is the inspection procedure command toinspect for the defect D2, in order to inspect for the presence orabsence of the next defect D2.

The flaw detection image analyzer 10 first captures the inspectionprocedure command C101, thereby knowing that the type of the defect tobe inspected for is D2 (Step S5). The flaw detection image analyzer 10also captures the display range (the range in which the startingposition X1 on the X axis is 0, the ending position X2 on the X axis is10, the starting position Y1 on the Y axis is 0, and the ending positionY2 on the Y axis is 20) (Step S6).

Then, the flaw detection image analyzer 10 captures the shape andmaterial of the corresponding portion of the object to be inspected(main wing), which corresponds to the display range acquired in Step S6,by reference to the CAD data stored in the three-dimensional CAD modeldivision 60, and stores the captured CAD data (the shape is F2, and thematerial is M2) in a form built into the inspection procedure commandC101 (Step S7).

Moreover, the plate thickness of the corresponding portion of the objectto be inspected (main wing) is measured by the plate thickness measuringdevice 70. The flaw detection image analyzer 10 captures the measuredplate thickness, and stores the captured plate thickness data (the platethickness is 10) in a form built into the inspection procedure commandC1 (Step S8).

The flaw detection image analyzer 10 refers to the second flaw detectioncondition database DB2 of the flaw detection condition database division40, acquiring the information set in the pattern comprising acombination of the defect type D2, plate thickness (10), shape (F2) andmaterial (M2), namely, the information that the flaw detection imagesused are I1 and I3, the arrangement pattern of the flaw detection imagesI1, I3 used is the placement of the two images in a laterally alignedarrangement, the contrast minimum value of the contrast indicated valuesdefining the contrast of the image in the display range is 20 for theflaw detection image I1 and 30 for the flaw detection image I3, and thecontrast maximum value is 40 for the flaw detection image I1 and 50 forthe flaw detection image I3 (Step S9).

By referring, in the above-mentioned manner, to the inspection procedurecommand C2 of the first flaw detection condition database DB1, the CADdata stored in the three-dimensional CAD model division 60, data on theplate thickness measured by the plate thickness measuring device 70, andthe second flaw detection condition database DB2, it becomes possible toacquire the information showing that the type of the defect to beinspected for is D2, the flaw detection images used in accordance withthe type D2 of the defect to be inspected for are I1, I3, thearrangement pattern of the flaw detection images I1, I3 used is theplacement of the two images in the laterally aligned arrangement, thedisplay range showing the range of the image region displayed among theimage regions of the flaw detection images I1, I3 used is the range inwhich the starting position X1 on the X axis is 0, the ending positionX2 on the X axis is 10, the starting position Y1 on the Y axis is 0, andthe ending position Y2 on the Y axis is 20, and the contrast minimumvalue of the contrast indicated values defining the contrast of theimage in the display range is 20 for the flaw detection image I1 and 30for the flaw detection image I3, and the contrast maximum value is 40for the flaw detection image I1 and 50 for the flaw detection image I3.

Based on the so acquired information, the flaw detection image analyzer10 displays two images in a laterally aligned arrangement on the displayscreen 31 of the image display device 30, the two images being images ofthe flaw detection images I1, I3 based on the flaw detection imagesignals i1, i3 and being in the above display range (the startingposition X1 on the X axis is 0, the ending position X2 on the X axis is10, the starting position Y1 on the Y axis is 0, and the ending positionY2 on the Y axis is 20) with the above contrast (the contrast minimumvalue is 20 for the flaw detection image I1 and 30 for the flawdetection image I3, and the contrast maximum value is 40 for the flawdetection image I1 and 50 for the flaw detection image I3).

The operator visually confirms the flaw detection images displayed onthe display screen 31 of the image display device 30 (the imagesdisplayed in a laterally aligned arrangement on the display screen 31with the specific contrast in the display range in the specific region(magnification) of the flaw detection images I1, I3) to evaluate whetherthe defect D2 is present or not (Step S10).

After visually evaluating the presence or absence of the defect D2, theoperator issues a command to proceed to a next action (Step S11).

Under this command, the flaw detection image analyzer 10 captures theinspection procedure command C102, and performs the actions of Steps S5to S9 while referring to the inspection procedure command C102, the CADdata stored in the three-dimensional CAD model division 60, the data onthe plate thickness measured by the plate thickness measuring device 70,and the second flaw detection condition database DB2. By so doing, theflaw detection image analyzer 10 displays two images in a laterallyaligned arrangement on the display screen 31, the two images beingimages of the flaw detection images I1, I3 and being in the displayrange in the specific region (the starting position X1 on the X axis is10, the ending position X2 on the X axis is 20, the starting position Y1on the Y axis is 0, and the ending position Y2 on the Y axis is 20) withthe specific contrast (the contrast minimum value is 20 for the flawdetection image I1 and 30 for the flaw detection image I3, and thecontrast maximum value is 40 for the flaw detection image I1 and 50 forthe flaw detection image I3).

The operator visually confirms the flaw detection images displayed onthe display screen 31 of the image display device 30 (the imagesdisplayed in a laterally aligned arrangement on the display screen 31with the specific contrast in the display range in the specific region(magnification) of the flaw detection images I1, I3) to evaluate whetherthe defect D2 is present or not (Step S10).

After visually evaluating the presence or absence of the defect D2, theoperator issues a command to proceed to a next action (Step S11).

Such actions are also performed under the inspection procedure commandsC103 . . . , which have been set consecutively, by reference to the CADdata stored in the three-dimensional CAD model division 60, the platethickness data from the measurement by the plate thickness measuringdevice 70, and the second flaw detection condition database DB2.

After the evaluation of the entire screen is completed in connectionwith the inspection for the presence or absence of the defect D2 (StepS12), the flaw detection image analyzer 10 captures the inspectionprocedure command CN, which is the inspection procedure command toinspect for the defect D3, in order to inspect for the presence orabsence of the next defect D3. The flaw detection image analyzer 10performs the same processings as mentioned above, and displays theimages. The operator visually confirms the displayed images, and canthereby evaluate whether the defect is present or not.

After the inspection procedure command C is executed up to the end andthe evaluation of all the defects is completed (Step S13), the flawdetection image analyzer 10 terminates the automatic operation (StepS14), and then the analysis work on the flaw detection images (defectdetection work) is completed (Step S15).

It is possible to make settings such that when the operator has visuallyconfirmed the defects, the sites and types of the defects are storedinto the flaw detection image analyzer 10 and, after completion of workon the defect inspection, the stored defective sites are displayed onthe display screen 31 by the type of the defect.

In the above-described manner, the flaw detection image analyzer 10performs the automatic operation, whereby the images of the optimal typein the optimal arrangement state, in the optimal display range(magnification) with the optimal contrast, are sequentially displayed onthe display screen 31 of the image display device 30 in accordance withthe type of each defect. Thus, the operator can conduct the inspectionfor the defect while looking at the display screen, without the need toselect the image or to carry out an operation for changing the displayposition, display magnification, or the like.

Hence, the inspection for the defect can be easily performed in a shorttime, and even an inspector with little experience can conduct thedefect inspection accurately without an omission of inspection.

Based on the type of the defect, plate thickness, shape, and material,moreover, the flaw detection image used, and the arrangement pattern andcontrast of the image are acquired from the second flaw detectioncondition database DB2. This obviates the necessity of registering theflaw detection image used, and the arrangement pattern and contrast ofthe image, individually on all the inspection procedure commands. Thus,it becomes easy to create a flaw detection condition database as awhole.

Furthermore, the plate thickness of the site to be inspected is actuallymeasured by the plate thickness measuring device 70, so that the platethickness data need not be stored in the database. Even if variations inthe plate thickness are present in each object to be inspected, a flawdetection test can be conducted using the correct setting conditions(plate thickness dimensions).

INDUSTRIAL APPLICABILITY

The present invention can be applied not only in detecting the defect ofa wing of an aircraft, but also in detecting a defect, by ultrasonicflaw defection, in various products to be inspected, in which a defectcan be detected by ultrasonic flaw detection.

DESCRIPTION OF THE NUMERALS

10 Flaw detection image analyzer

20 Input device

30 Image display device

31 Display screen

40 Flaw detection condition database division

50 Flaw detection image signal database division

60 Three-dimensional CAD model division

70 Plate thickness measuring device

1. An analytical apparatus for an ultrasonic flaw detection image,comprising: a flaw detection image signal database division storing aplurality of flaw detection image signals obtained by signaltransformation of an identical flaw detection waveform signal by aplurality of different signal transformation techniques; a flawdetection condition database division storing a flaw detection conditiondatabase constructed from many inspection procedure commands arranged inorder of execution, the inspection procedure commands having, asinformation, a type of a defect to be inspected for, a flaw detectionimage used in accordance with the type of the defect to be inspectedfor, an arrangement pattern of the flaw detection image used, a displayrange showing a range of an image region displayed among image regionsof the flaw detection image used, and contrast indicated values defininga contrast of an image in the display range; and a flaw detection imageanalyzer, wherein the flaw detection image analyzer captures theinspection procedure commands of the flaw detection condition databasesequentially based on input commands from an outside, whenever theinspection procedure command is captured, captures from the flawdetection image signal database division the flaw detection image signalcorresponding to the flaw detection image indicated by the capturedinspection procedure command, and allows a display device to display theflaw detection image based on the flaw detection image signal in thearrangement pattern of the image indicated by the inspection procedurecommand, in the display range indicated by the inspection procedurecommand, and with the contrast indicated by the inspection procedurecommand.
 2. An analytical apparatus for an ultrasonic flaw detectionimage, comprising: a flaw detection image signal database divisionstoring a plurality of flaw detection image signals obtained by signaltransformation of an identical flaw detection waveform signal by aplurality of different signal transformation techniques; a flawdetection condition database division storing a first flaw detectioncondition database constructed from many inspection procedure commandsarranged in order of execution, the inspection procedure commandshaving, as information, a type of a defect to be inspected for, and adisplay range showing a range of an image region displayed among imageregions of a flaw detection image used; and a second flaw detectioncondition database defining the flaw detection image used, anarrangement pattern of the flaw detection image used, and contrastindicated values defining a contrast of an image in the display range,for each pattern comprising a combination of the type of the defect, aplate thickness, a shape, and a material; a CAD model division havingdesign data at least including data on a plate thickness, a shape and amaterial of an object to be inspected; and a flaw detection imageanalyzer, wherein the flaw detection image analyzer captures theinspection procedure commands of the first flaw detection conditiondatabase sequentially based on input commands from an outside, wheneverthe inspection procedure command is captured, captures from the CADmodel division the plate thickness, shape, and material of acorresponding portion of the object to be inspected, which correspondsto the display range indicated by the captured inspection procedurecommand; incorporates the captured plate thickness, shape and materialinto the inspection procedure command; and captures by reference to thesecond flaw detection condition database the flaw detection image used,the arrangement pattern of the flaw detection image used, and thecontrast indicated values defining the contrast of the image in thedisplay range, which are defined for the pattern comprising thecombination of the type of the defect, and the plate thickness, theshape, and the material captured from the CAD model division, andcaptures from the flaw detection image signal database division the flawdetection image signal corresponding to the flaw detection image used,and allows a display device to display the flaw detection image based onthe flaw detection image signal in the captured arrangement pattern ofthe image, in the captured display range, and with the capturedcontrast.
 3. An analytical apparatus for an ultrasonic flaw detectionimage, comprising: a flaw detection image signal database divisionstoring a plurality of flaw detection image signals obtained by signaltransformation of an identical flaw detection waveform signal by aplurality of different signal transformation techniques; a flawdetection condition database division storing a first flaw detectioncondition database constructed from many inspection procedure commandsarranged in order of execution, the inspection procedure commandshaving, as information, a type of a defect to be inspected for, and adisplay range showing a range of an image region displayed among imageregions of a flaw detection image used; and a second flaw detectioncondition database defining the flaw detection image used, anarrangement pattern of the flaw detection image used, and contrastindicated values defining a contrast of an image in the display range,for each pattern comprising a combination of the type of the defect, aplate thickness, a shape, and a material; a CAD model division havingdesign data at least including data on a shape and a material of anobject to be inspected; a plate thickness measuring device for measuringa plate thickness of the object to be inspected; and a flaw detectionimage analyzer, wherein the flaw detection image analyzer captures theinspection procedure commands of the first flaw detection conditiondatabase sequentially based on input commands from an outside, wheneverthe inspection procedure command is captured, captures from the CADmodel division the shape and material of a corresponding portion of theobject to be inspected, which corresponds to the display range indicatedby the captured inspection procedure command; incorporates the capturedshape and material into the inspection procedure command; simultaneouslycaptures the plate thickness measured by the plate thickness measuringdevice as a plate thickness of the corresponding portion of the objectto be inspected, which corresponds to the display range indicated by thecaptured inspection procedure command; and captures by reference to thesecond flaw detection condition database the flaw detection image used,the arrangement pattern of the flaw detection image used, and thecontrast indicated values defining the contrast of the image in thedisplay range, which are defined for the pattern comprising thecombination of the type of the defect, and the plate thickness, theshape, and the material captured from the CAD model division and theplate thickness measuring device, and captures from the flaw detectionimage signal database division the flaw detection image signalcorresponding to the flaw detection image used, and allows a displaydevice to display the flaw detection image based on the flaw detectionimage signal in the captured arrangement pattern of the image, in thecaptured display range, and with the captured contrast.